Camera Unit of Fuji CP-842E CP-842ME High-Speed Chip Placer

Troubleshooting Summary:

Having issues with Camera Unit of Fuji CP-842E CP-842ME High-Speed Chip Placer? Read our step-by-step SMT maintenance solution below. If you require replacement feeders, nozzles, or sensors, contact SMTBOX for OEM-compatible parts.

The machine is equipped with two cameras, each camera being used to process different parts.

A high resolution narrow view camera is used to acquire images of small components such as 0603s (0201s), 1005s (0402s) and super small SOTs, and a wide view camera is used for components such as SOICs, PLCCs and CSPs.

The system offers excellent versatility by being able to change between background or foreground lighting enabling the unit ユ s capability to obtain a sharp outline of the part, or position parts such as PLCCs by their J-leads and CSPs by their bumps.

1. Specifications

S_Narrow*1 Support for 0402 (01005) parts | Part size (mm): 0402 (01005) – 2012 (0805), etc.

Narrow | Part size (mm): 0603 (0201) – 3216 (1206)

Wide | Part size (mm): 2012 (0805) – 19 × 19*2

Lighting Foreground and background lighting

Notes:

a. Support for 0402 (01005) parts is available by replacing the lens unit of the narrow view camera.

b. Background lighting for parts of up to 14 × 14 mm.

2. Supported CSPs

Item Narrow Wide Max. size Under inspection 19 × 19 mm Min. bump pitch Under inspection 0.5 mm Min. bump diameter Under inspection 0.3 mm Min. bump gap Under inspection 0.2 mm Orientation check Possible*1 Possible*1
Item Narrow Wide Max. size Under inspection 19 × 19 mm Min. bump pitch Under inspection 0.5 mm Min. bump diameter Under inspection 0.3 mm Min. bump gap Under inspection 0.2 mm Orientation check Possible*1 Possible*1

Notes:

a. If incorrect orientation is detected, a vision error is issued and the part is rejected. This function can be used on the condition that bump arrangements are not perfectly symmetric, all bumps are registered in the part settings, and the bump detection rate is set to 100%.

b. Detection of missing bumps does not include flattened or deformed bumps.

c. The pitch of at least three bumps in each outer row must be the same.

d. Contact Fuji for information regarding components not listed. Also contact Fuji if a component body coating (CSP etc.) causes some thickness variation at the component edges. Such variations may complicate the component inspection process.

SMTBOX Editorial & Engineering Team
Written by: SMTBOX Editorial & Engineering Team

Our editorial team consists of senior SREs, mechanical engineers, and SMT assembly specialists with over 15 years of industry experience in PCB assembly line optimization. All technical articles are reviewed and verified for mechanical and electronic compatibility before publication.

SMTBOX Assistant
Search part numbers & models

SMTBOX Assistant

Hello! I'm your AI assistant. Tell me the machine model or part number you're looking for.
Your subscription could not be saved. Please try again.
Your subscription has been successful.
This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.
This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.